A thermo-laminated multilayered zircon based high temperature co-fired ceramic (htcc) tape and the process thereof

Kuzhichalil Peethambharan Surendran, Mailadil Thomas Sebastian, Jobin Varghese

The present invention provides a low cost preparation of ultra-low CTE and low dielectric loss high temperature cofired ceramic (HTCC) substrates for highly integrated monolithic millimeter- wave integrated circuits (MMICs) utilized in high temperature environment. This HTCC zircon substrate is advantageous over currently available HTCC substrates in terms of cost effect – iveness, excellent dielectric properties, close to zero thermal expansively, high thermal conductivity and good mechanical properties.